Broadcom Combo Chip Gets a 2012 CES Innovations Design and Engineering Award

2012 CES Design and Engineering Award Recognizes Chip that Drives Innovation in Smart Phones and Tablets

  • Broadcom’s BCM4330 combo chip is named a 2012 CES Innovations Design and Engineering Award Honoree
  • Wireless connectivity solution, which provides latest Bluetooth and Wi-Fi features, is being adopted by top-tier phone and tablet makers to support more media and data applications
  • Award exemplifies Broadcom’s leadership in wireless connectivity for consumer electronic devices

Broadcom Corporation  has been named a 2012 CES Innovations Design and Engineering Awards Honoree in the Embedded Technologies product category for its InConcert® BCM4330 wireless connectivity combo chip. The announcement was made at the 2012 CES New York Press Preview in New York City.

The highly integrated, third generation combo chip supports today’s most innovative and compelling mobile applications.  The BCM4330 was selected for its combination of low power, small size and advanced wireless functionality, allowing mobile device makers to deliver new, engaging mobile experiences.

Robert Rango, executive vice president and general manager of Broadcom’s Mobile and Wireless Group, said Broadcom is “proud to be selected by the Consumer Electronics Association for this prestigious award, highlighting our commitment to driving innovations that bring the newest, most advanced features like Wi-Fi Direct and Bluetooth low energy to next generation CE devices. The BCM4330 represents the pinnacle of wireless semiconductor integration, with its benefits now available in some of the most popular mobile devices on the market.”

The BCM4330 also supports Wi-Fi Direct™ and Bluetooth High Speed that enable mobile devices to communicate directly with each other at high speed without having to connect first to an access point, supporting multiple wireless device-to-device applications and usage models.

In addition, the Broadcom® BCM4330 was the industry’s first combo chip solution certified with the Bluetooth 4.0 standard, which enables Bluetooth Low Energy applications. This makes the BCM4330 the ideal solution for systems with long-term always-on portability requirements, such as wireless sensors for medical and fitness monitoring devices.

 The BCM4330 is shipping in volume production and will be on display starting January 9, 2012 at the CES Innovations Showcase in the Venetian Ballroom of the Venetian Hotel in Las Vegas.

The CES Innovations Design and Engineering Awards have been highlighting excellence in consumer electronics innovation since 1976, with winners selected by a distinguished panel of independent engineers and members of the trade press.

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Social Media Strategist at Broadcom with many years of tech journalism and public relations experience.

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