Broadcomâ€™s Brad Davis, manager of radio frequency and wireless engineering in the Mobile and Wireless Group, was named Test Engineer of the Year by Test and Measurement World magazine.
Davis is recognized for his innovative testing methods and engineering achievements for his work on Broadcom’s flagship BCM4330 combo chip, which combines multiple cutting-edge wireless systems (802.11n Wi-Fi, Bluetooth 4.0 and FM radio) on a single silicon die.
Along with his team, Davis pioneered new techniques and tools that boost test coverage and improving test speeds.
“Brad takes pride in applying his leadership in the continuous development of new test methodologies, trying to keep his team one step ahead of test requirements,â€ť said Michael Hurlston, senior vice president and general manager of Broadcomâ€™s WLAN line of business in the Mobile and Wireless Group. â€śBy greatly improving test turnaround time and providing invaluable insights to design teams to improve testability of future chips, Brad has enabled Broadcom to produce the leading WLAN product in the world.”
â€śThere is a big signoff procedure and itâ€™s satisfying to reach those milestones,â€ť he said. â€śI like it when we solve technical challenges â€“ that happens every day.â€ť
Test & Measurement World’s annual Test Engineer of the Year award pays tribute to the important contributions that test engineers make to the quality of electronics components, products and systems.
The award includes a $10,000 grant to an engineering program in Davisâ€™ honor.
Davis received the award at the Best in Test awards ceremony in January, which was held in conjunction with the 2012 DesignCon event in Santa Clara, Calif.
Related: BCM4330 combo chip won a 2012 CES Innovations and Design Engineering Award at the Consumer Electronics Show held in Las Vegas in January.